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COTS Conference |
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International Military & Aerospace/Avionics |
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Below are links of interest: |
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This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. |
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Let twelve specialists show you how to test, analyze, and achieve better microelectronic reliability of silicon and GaAs devices. Microelectronic Reliability, Volume I: Reliability, Test, and Diagnostics offers you detailed, original works on the topics most vital to both device and equipment reliability and manufacturing yield. Broad enough to serve as an effective textbook and in-depth enough for practicing engineers, this text also makes an ideal reference for managers who need a quick overview of current reliability, test, and failure analysis issues. Supported by 600 references, 147 figures, and 39 tables, this encyclopedic guide shows you how to identify the thermal, chemical, and mechanical processes that influence the incidence and severity of failure mechanisms. This coverage outlines techniques for assessing the susceptibility to failure of various devices. Detailing the theory and operation of current failure analysis tools, the text also gives you instrument price ranges and example analyses. |
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Influence of Temperature on Microelectronics and System Reliability: A Physics of Failure Approach |
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Microelectronic Reliability: Volume 1: Reliability, Test and Diagnostics |
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C3I, Inc. Edward B. Hakim 2412 Emerson Avenue Spring Lake Heights, NJ 07762 |
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